Production of printed circuit boards
Production of printed circuit boards
The printed circuit board is the base on which your product is mounted. The function of the whole device depends on the quality of this base and therefore it is impossible to neglect the issue of PCB production.
For more than 20 years we have been fruitfully cooperating with several (two, three -?) printed circuit board factories that are able to meet any requirements of our customers. Do you need an aluminum board for your LED flashlight or do you use Rogers materials because your product really needs them? Or maybe in two millimeters thick you have more than twenty layers?
We will help you with the production of printed circuit boards just for your needs.
Materials | FR-4, High Tg FR-4, Halogen free, Al, Rogers |
Maximum board size, mm | 550*750 for two-layer boards |
Maximum board thickness, mm | 6,5 |
Minimum board thickness, mm | 0,4 |
Minimum board size, mm | 10,16*10,16 |
The minimum gap between the hole and the edge of the board is equal to the thickness of the board | |
Holes clearances | |
Minimum hole, mm | 0,1 |
Clearance for metallized holes | ±2mil |
Clearance for non-metallized holes | ±2mil |
Taper of openings (t <0.6 mm) | ±6 mil |
The accuracy of the contour | |
– when felling | ±6 mil |
– when milling | ±2mil |
Coating parameters | |
Coating materials | HASL, HASL LF, ENIG, ENEPIG, OSP, Carbon, |
Minimum metallization thickness | 3 µm |
Minimum Au coating thickness | 0.05 µm (for ENIG) |
Minimum Ni coating thickness | 3 µm |
HAL-process | 2-40 µm |
Soldering mask | |
The minimum width of the mask line, mm | 0,1 |
The minimum width between platforms, mm | 0,1 |
Mask thickness of: | |
– platforms | 0.4 to 0.7 mil |
– conductors | 0.2 to 0.5 mil |
The minimum thickness for FR-4 that can be saved, mm | 0.25 |
Minimum board size for V-cut, mm | 75*75 |
Minimum board thickness for V-cut, mm | 0.5 |
Acceptable angles | 20°, 30° and 45° |
Manufacturing accuracy with V-cut | ±5° |
Outer/inner layers | |
Minimum aperture, mm | 0,01 |
Minimum width of the conductor, mm | 0,1 |
Minimum gap between conductors: | |
for the inner layer, mm | 0,06 |
for the outer layer, mm | 0,075 |
The minimum final thickness of two-layer, mm | 0,4 |
– 4-layer, mm | 0,4 |
– 6-layer, mm | 0,8 |
Maximum final thickness of copper | 210 µm or 0,0083″ or 6 oz |
Maximum number of layers | 40 |
Production of stencils
From many sources of information it is known that approximately 50% of defects that occur during the installation of products are caused by defects in the application of solder paste. These defects may be due to either the wrong settings of your printer for applying solder paste or an incorrectly designed stencil.
We have many years of experience in designing and manufacturing stencils for applying solder paste. Thanks to this experience, we can confidently say that you can get the expected result of installation only on stainless steel stencils cut by laser.
For production of stencils we use the equipment exclusively of the LPKF company (Germany) with the subsequent processes of finishing of a surface of a sheet of metal. It can be mechanical polishing or electropolishing.
The thickness of the metal has a fixed range of values: 0.08 mm, 0.1 mm, 0.12 mm and 0.15 mm. The size of the stencil is limited to a maximum of 600×730 mm.
